Ahmedabad, July 3 (IANS) Prime Minister Narendra Modi will visit Gujarat on Saturday, where he is scheduled to inaugurate the CG Semi Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand in Ahmedabad district, marking the commencement of commercial production at one of India’s first semiconductor assembly and testing plants developed under the ‘India Semiconductor Mission’.

According to the Prime Minister’s Office, he will arrive in Sanand at around 4:30 p.m. after completing engagements in Rajasthan and will address a gathering following the inauguration.

The CG Semi OSAT facility has been developed with an investment of more than Rs 7,500 crore and is among the first four semiconductor projects approved under the Mission.

The facility is designed to provide end-to-end semiconductor assembly and testing services, including wafer sorting, assembly, testing, package design, failure analysis, test programme development, product characterisation and logistics support.

Once fully ramped up, the plant will have an annual production capacity of up to five billion semiconductor chips.

The facility is expected to serve customers across the automotive, industrial, telecommunications, 5G and Internet of Things (IoT) sectors, addressing growing demand for memory and storage solutions driven by advances in artificial intelligence and high-performance computing.

The Prime Minister’s Office said the inauguration marks “a significant milestone in India’s semiconductor manufacturing journey with the commencement of commercial production at the facility”.

It added that the project represents a major step forward in strengthening India’s position in the global semiconductor value chain.

PM Modi’s Gujarat visit follows his engagements in Rajasthan earlier in the day, where he will inaugurate the new terminal building at Jodhpur Airport, launch the Modified UDAN scheme, and dedicate, inaugurate and lay the foundation stone for development projects worth about Rs 1.06 lakh crore in Balotra.

The Sanand project is expected to strengthen India’s domestic semiconductor manufacturing ecosystem by expanding advanced chip packaging and testing capabilities, an important segment of the semiconductor supply chain, as the country seeks to increase its presence in global electronics manufacturing.

–IANS

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